Product Description
The Zeta-388 optical profiler is a non-contact, 3D surface topography measurement system. The Zeta-388 builds on the capability of the Zeta-300 with the addition of a cassette-to-cassette handler for fully automated measurements. The system is powered by patented ZDot technology and Multi-Mode optics, enabling measurement of a variety of samples: transparent and opaque, low to high reflectance, smooth to rough texture, and step heights from nanometer to millimeters.
The Zeta-388 automated optical metrology system integrates six different optical metrology technologies in one configurable and easy-to-use system. ZDot measurement mode simultaneously collects a high-resolution 3D scan and a True Color infinite focus image. Other 3D measurement techniques include white light interferometry, Nomarski interference contrast microscopy, and shearing interferometry. Film thickness can be measured with ZDot or an integrated broadband reflectometer. The Zeta-388 is also a high-end microscope that can be used for sample review or automated defect inspection. The Zeta-388 supports both R&D and product environments by providing comprehensive step height, roughness, and film thickness measurements, defect inspection capability, and cassette-to-cassette wafer handling.
The Zeta-388 provides automated metrology solutions for wireless device manufacturing such as Surface Acoustic Wave (SAW), Bulk Acoustic Wave (BAW), and Thin Film Bulk Acoustic Resonator (FBAR) devices.
Features
- Easy to use non-contact optical profiler with ZDot and Multi-Mode optics to address a wide range of applications
- High-quality microscope sample review or defect inspection
- ZDot: Simultaneously collects a high-resolution 3D scan and a True Color infinite focus image
- ZXI: White light interferometry for wide area measurements with high z resolution
- ZIC: Interference contrast for quantitative 3D data of surfaces with sub-nanometer roughness
- ZSI: Shearing interferometry for images with high z resolution
- ZFT: Film thickness and reflectance is measured with an integrated broadband reflectometer
- AOI: Automatic optical inspection to quantify defects on the sample
- Production capability: Fully automated measurements with sequencing and pattern recognition
- Wafer handler: Automatically load opaque (e.g., silicon) and transparent (e.g., sapphire) samples, 50mm through 200mm in diameter
Applications
- Step height: 3D step height from nanometers to millimeters
- Texture: 3D roughness and waviness on smooth to very rough surfaces
- Form: 3D bow and shape
- Stress: 2D thin film stress
- Film thickness: transparent film thickness from 30nm to 100µm
- Defect inspection: capture defects greater than 1µm
- Defect review: KLARF files are used to navigate to defects to measure 3D surface topography or scribe defect locations
Industries
- Wireless Device Manufacturing for SAW, BAW, and FBAR devices
- LED: light emitting diodes and PSS (patterned sapphire substrates)
- Semiconductor and compound semiconductor
- Semiconductor WLCSP (wafer-level chip scale packaging)
- Semiconductor FOWLP (fan-out wafer-level packaging)
- PCB (printed circuit board) and flexible PCB
- MEMS: Micro-electro-mechanical systems
- Medical devices and microfluidic devices
- And more: Contact us with your requirements