HRP^®-260 Stylus Profiler

The HRP^®-260 is a high resolution, cassette-to-cassette stylus profiler offering step height measurement capability from a few nanometers to 300µm. The P-260 configuration supports 2D and 3D measurements of step heights, roughness, bow, and stress for scans up to 200mm without stitching. The HRP^®-260 high resolution profiler configuration offers the same capability as the P-260, plus a high resolution stage that produces scanning results similar to an AFM. The high resolution profiler HRP platform has advanced pattern recognition algorithms that enhance recipe transportability between systems, a key requirement for a 24x7 production environments.

Product Description

The HRP^®-260 high-resolution, cassette-to-cassette stylus profiler offers production proven performance with automated wafer handling capability serving the semiconductor, compound semiconductor, high brightness LED, data storage and related industries. The P-260 configuration supports 2D and 3D high-resolution measurements of step heights, roughness, bow, and stress for scans up to 200mm without stitching. The HRP^®-260 configuration offers the same capability as the P-260, plus a high-resolution stage to measure small features at higher resolution and faster throughput.

The HRP^®-260 offers dual stage capability for measurement of nano- and micro-surface topography. The P-260 configuration offers long scan (up to 200mm) capability without stitching, and the HRP^®-260 offers a high-resolution scanning stage for up to 90µm scan lengths. The P-260 achieves excellent measurement stability with a combination of the UltraLite^® sensor, constant force control and ultra-flat scanning stage. The HRP^®-260 enhances the capability with a high-resolution piezoelectric scanning stage. Recipe setup is fast and easy with point-and-click stage controls, low and high magnification optics, and high-resolution digital cameras. The HRP^®-260 supports 2D and 3D surface measurement, with a variety of filtering, leveling, and data analysis algorithms to quantify the surface topography. Fully automated measurements are achieved with automated wafer handling, pattern recognition, sequencing and feature detection.

Features

Step Height: Nanometers to 327µm
Low force with constant force control: 0.03 to 50mg
Scan full diameter of the sample without stitching
Video: In-line low and high magnification optics
Arc Correction: Removes error due to arc motion of the stylus
Software: Easy-to-use software interface
Production Capability: Fully automated with sequencing, pattern recognition, and SECS/GEM
Wafer Handler: Automatically loads 75mm through 200mm opaque (e.g., silicon) and transparent (e.g., sapphire) samples
HRP: High-resolution scanning stage with resolution similar to an AFM

Applications

Step Height: 2D and 3D step height
Texture: 2D and 3D roughness and waviness
Form: 2D and 3D bow and shape
Stress: 2D and 3D thin film stress
Defect Review: 2D and 3D defect surface topography

Industries

Wireless Device Manufacturing for SAW, BAW, and FBAR devices
Semiconductor
Compound semiconductor
LED: Light emitting diodes
MEMS: Micro-electro-mechanical systems
Data storage
Automotive
And more: Contact us with your requirements

Step Height

The HRP^®-260 is capable of measuring 2D and 3D step heights from nanometers to 327µm. This enables quantification of material deposited or removed by processes, including etch, sputter, deposition, spin coatings, CMP and other processes. The HRP^®-260 has constant force control that dynamically adjusts to apply the same force, regardless of step height. This results in good measurement stability and enables accurate measurement of soft materials, such as photoresist.

Texture: Roughness and Waviness

The HRP^®-260 measures 2D and 3D texture, quantifying the sample’s roughness and waviness. Software filters separate the measurement into roughness and waviness components and calculate parameters, such as the root mean square (RMS) roughness.

Form: Bow and Shape

The HRP^®-260 can measure the 2D shape or bow of a surface. This includes measurement of wafer bow that can result from mismatch between process layers during device fabrication, such as the deposition of multiple layers for the production of semiconductor or compound semiconductor devices. The HRP^®-260 can also quantify the height and radius of curvature of structures, such as a lens.

Stress: 2D and 3D Thin Film Stress

The HRP^®-260 is capable of measuring the stress induced during the manufacture of devices with multiple process layers, such as semiconductor or compound semiconductor devices. The bow of the sample is accurately measured using a stress chuck to support the sample in a neutral position. The change in shape from a process, such as film deposition, is used to calculate the stress by applying Stoney’s equation. 2D stress is measured with a single scan across the sample diameter up to 200mm without the need to stitch. 3D stress is measured using a combination of 2D scans, with the theta stage rotating between scans to measure the full sample surface.

Defect Review

Defect Review is used to measure the topography of defects, such as the depth of a scratch. Defect inspection tools identify defects and write the location coordinates to a KLARF file. The Defect Review feature reads the KLARF file, aligns the sample, and allows the user to select defects for 2D or 3D measurements.

The options for the HRP^®-260 Stylus Profiler are available to add on with your new product, or in the future. Contact your sales rep to learn more.

High-Resolution Stage

The HRP^®-260 utilizes a piezoelectric stage that has 90 x 90µm scan range with 1nm resolution, similar to the capability of an AFM. The high-resolution stage combined with Feature Find can be used to precisely locate the feature of interest, enabling rapid measurement of submicron features for use in a production environment. R&D also benefits from high-resolution 3D scanning, using the HRP^®-260 to measure the impact of changes in process parameters, new layer development, or quantifying the topography of defects when combined with the Defect Review software.

Upgrade to HRP^®-260 Stylus Profiler

The HRP^®-240 and HRP^®-250 systems can be upgraded to HRP^®-260. This upgrade extends the lifetime of your current HRP system, utilizing the latest electronics offered by KLA. The upgrade includes profiler software with algorithms that significantly improve pattern recognition performance and recipe transportability between tools. HRP^®-260 systems have roughly double the HRP-240 system throughput, based on a production five-site sequence recipe. The upgrade kit includes a new computer with Windows^® 7, new electronics with USB communication, high-resolution digital cameras, a 23-inch flat screen monitor, and the latest profiler software.

Stylus Options

The HRP^®-260 has a variety of styli available to support the measurement of step heights, high aspect ratio steps, roughness, sample bow, and stress. The tip radius ranges from 20nm to 50µm and determines the lateral resolution of the measurement. The included angle ranges from 20 to 100 degrees, which specifies the maximum aspect ratio of the measured feature. All styli are manufactured from diamond to reduce tip wear and increase their lifetime. The DuraSharp^® stylus has a 40nm tip radius and is typically used for HRP production measurements, providing resolution similar to an AFM.

Sample Chucks

The HRP^®-260 has a range of chucks available to support application requirements. The standard is a vacuum chuck for measuring samples from 75mm to 200mm. A stress chuck is available with 3-point locators that support the sample in a neutral position for accurate bow measurements. Additional options for bowed wafer sample handling are available.

Handler Options

The HRP^®-260 handler includes an aligner for opaque wafers (e.g., GaAs) and a cassette station for 200mm wafers. Options include transparent sample alignment (e.g., sapphire), smaller sample sizes from 75mm to 150mm, a second cassette station, a cassette slot mapper, and a signal tower.

Step Height Standards

The HRP^®-260 uses thin and thick film NIST traceable step height standards offered by VLSI Standards. The standards feature an oxide step on a 200mm Si wafer. A step height range of 8nm to 100µm is available.

Apex Analysis Software

Apex analysis software enhances the standard data analysis capability of the HRP^®-260 with an extended suite of leveling, filtering, step height, roughness, and surface topography analysis techniques. Apex supports ISO roughness calculation methods, plus local standards, such as ASME. Apex can also serve as a report writing platform with the capability to add text, annotations, and pass/fail criteria. Apex is offered in eleven languages.

Offline Analysis Software

The HRP^®-260 offline software has the same data analysis and recipe creation capability that exists on the tool. This enables the user to create recipes and analyze data without using valuable tool time.

Pattern Recognition

Pattern recognition uses pre-taught patterns to automatically align the sample. This enables fully automated measurements for enhanced measurement stability by reducing the impact of operator error. Pattern recognition combined with advanced calibrations reduces stage positioning error and enables seamless transfer of recipes between systems.

SECS/GEM and HSMS

SECS/GEM and HSMS communications support factory automation systems and enable remote control of the HRP^®-260. Measurement results are automatically reported to host SPC systems, plus alarms and key calibration/configuration data. The HRP^®-260 is compliant with SEMI standards E4, E5, E30, and E37.

General Information about Stylus-based Surface Profilers from KLA Instruments^™

This application note discusses components and technologies specific to the KLA Instruments stylus profilers, including topography measurement, force control, scanning mechanism, stylus types and dimensions, and stylus profilometry applications.

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Multi-Step Analysis Function: Powerful Analytics from KLA Instruments^™ Surface Profilers

Multi-Step Analysis is a new automated algorithm that automatically measures step height/trench depth for up to 30 features along a scan profile, including automatic cursor placement. This capability significantly improves time-to-results and removes measurement variability relative to previous manual methods.

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Topography Sensor Technology for Stylus Profilers

The topography sensor is one component of the stylus measurement head, which is used to track the surface of the sample being measured. Three major sensor types are LVDT, Optical Lever and LVDC, and this application note discusses the design of each.

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Precision Depth Measurement of Shallow SIMS Craters using a KLA Instruments^™ Stylus Profilometer

The depth of SIMS craters generated by ion beam milling is used to determine the concentration of impurities. The objective of this application note is to present a technique to accurately measure the depth of shallow SIMS craters using a stylus profiler.

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Profiler Pattern Recognition Selection

KLA Instruments^™ Tencor^™ P-Series stylus profilometers offer pattern recognition capability for automated surface analysis. This application note describes pattern recognition and its usage for automated sample alignment for the Tencor P-7, P-17, P-170, and HRP-260 profilometers.

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Stylus Product Line

KLA Instruments^™ stylus profilometers may be used with different styli to optimize measurements for specific applications. The KLA profilers, including the Alpha-Step^® D-Series, Tencor^™ P-Series and High Resolution Profiler (HRP^®) Series all use the same stylus design. This application note discusses the various types of styli available for these stylus profilometers and typical applications for their use.

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3D Surface Measurement Parameters

When using the Tencor^™ P-7, P-17 and P-170, and HRP^®-260 surface profilometers, the user sets up scan recipes which include calculations of various 3D surface metrology measurement parameters, including surface roughness. This application note provides mathematical detail regarding the equations used to generate the parameter values.

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2D Surface Measurement Parameters

When using the Tencor^™ P-7, P-17 and P-170, and HRP^®-260 surface profilometers, the user sets up scan recipes which include calculations of various 2D surface metrology measurement parameters, including surface roughness. This application note provides mathematical detail regarding the equations used to generate the parameter values.

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Thin Film Stress Measurements using KLA Stylus-Based Profilers

For Tencor^™ and P-Series stylus profilers, the full-diameter profile measurement can be taken before and after film deposition to calculate the induced thin film stress. Hardware and software usage recommendations are also included.

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Apex Software

Stylus profilers from KLA Instruments are available with advanced 2D/3D surface analysis software to provide additional insight into profilometer measurement data. The Apex software includes data processing, analysis, visualization and reporting capabilities for both 2D profiles and 3D topography.

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HRP^®-260 Stylus Profiler

HRP^®-260 Stylus Profiler

Product Description

Features

Applications

Industries

Step Height

Texture: Roughness and Waviness

Form: Bow and Shape

Stress: 2D and 3D Thin Film Stress

Defect Review

High-Resolution Stage

Upgrade to HRP^®-260 Stylus Profiler

Stylus Options

Sample Chucks

Handler Options

Step Height Standards

Apex Analysis Software

Offline Analysis Software

Pattern Recognition