UV Laser Drilling
KLA's UV laser drilling systems deliver advanced UV drilling performance for challenging IC substrate, flex printed circuits and assembly applications. The systems enable manufacturers to achieve continuously high-quality, high-accuracy, high-throughput drilling of even the smallest vias. Supporting a wide variety of drilling applications, including blind vias (BV), through hole vias (THV) and routing, our UV laser drilling systems provide superior production processing for improved quality and yield.
Orbotech Apeiron™
UV Laser Drilling for Flex PCBs
The Orbotech Apeiron™ 800 series of UV laser drilling systems provides best-in-class, high-speed UV laser drilling for roll-to-roll (R2R) and sheet-by-sheet panel manufacturing of flexible printed circuits. Leveraging two new technologies–Roll Inside™ and Continuous Beam Uniformity (CBU)™–as well as its field-proven Multi-Path™ technology, the systems enable manufacturers to achieve continuously high-quality, high-accuracy drilling of vias with registration accuracy down to ±12μm and maximum throughput. The Orbotech Apeiron series is designed for a wide variety of drilling applications, including blind vias (BV), through-hole vias (THV) and routing.
Flexible PCBs, Roll-to-roll panels, Sheet-by-sheet panels, Blind vias, Through-hole vias, Routing
Orbotech Apeiron 800XT
High speed UV laser drilling with 4 drilling channels and Roll Inside technology for flex roll drilling up to 520mm wide.
Orbotech Apeiron 800SBS
High speed UV laser drilling with 4 drilling channels for flex sheet panel drilling.
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