Chemistry Process Control

KLA’s chemistry process control products support multiple applications within the printed circuit board (PCB) and IC substrate manufacturing environments, including analysis and monitoring of plating and coating chemistries. Analysis systems use a patented cyclic voltametric stripping (CVS) technique to analyze PCB plating baths to help ensure optimal plating. Systems test the quality of metallization on plated components or wires, helping PCB manufacturers ensure readiness for solder and wirebond. Chemical management systems enable online monitoring and control for plating processes during high volume manufacturing of IC substrates and PCBs. The information produced by these chemistry process control systems allows PCB and IC substrate manufacturers to optimize processes and achieve higher yield.

ECI

Chemistry Process Monitoring

ECI Technology provides chemistry process monitoring products that support PCB manufacturing, including:

Products that analyze PCB plating baths: https://www.ecitechnology.com/products/printed-circuit-boards/plating/
Products that test the quality of metallization on plated components or wires: https://www.ecitechnology.com/products/printed-circuit-boards/surface-analysis-and-coating-characterization/
Products that monitor and control plating conditions for IC substrates and PCBs: https://www.ecitechnology.com/products/printed-circuit-boards/quali-fill-libra-a-series/

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