IC Substrates, Part II: Six Yield-Critical Challenges for Manufacturers
Jul 20, 2023 17 min read
Part II of this series on integrated circuit (IC) substrates focuses on six yield-critical challenges ICS manufacturers should tackle to...
A Fine Future: IC Substrates Essentials, Part I
Jun 29, 2023 5 min read
The electronics industry’s quest for higher performance and greater speed continues to intensify, driving growing complexity in front end semiconductor...
Plasma Dicing 101, Part II
May 9, 2023 5 min read
Dicing takes place near the end of the semiconductor process flow. At this point the silicon wafer is finally turned...
New KLA Manufacturing Plant in South Korea Drives Innovation in Flat Panel Displays
Apr 13, 2023 4 min read
As flat panel display (FPD) technologies continue to advance, KLA unveiled its first manufacturing facility in South Korea to better...
KLA Instruments™ Biomedical Solutions Protect Patients, Increase Yield for Manufacturers
Apr 4, 2023 4 min read
In the biomedical industry, many different types of devices such as sensors, monitors, prosthetics, drug delivery systems and implants are...
Reflecting on 10 Years of The Karel Urbánek Best Student Paper Award
Mar 21, 2023 3 min read
Each year since 2013, SPIE announces The Karel Urbánek Best Student Paper Award in conjunction with the SPIE Advanced Lithography...
Vapor Etch Solutions for Releasing MEMS
Feb 23, 2023 3 min read
Microelectromechanical systems (MEMS) are miniaturized systems that can be challenging to make and are relatively fragile. Often smaller than 1...
KLA Celebrates the 75th Anniversary of the Transistor
Dec 16, 2022 4 min read
Semiconductors chips – the heart of our modern electronic devices – are built atop a technology first introduced 75 years...
KLA Docu-Series: The Toughest Problems Solved by Engineers for Axion® T2000
Dec 13, 2022 1 min read
What is the toughest problem you ever solved? For a team of engineers and scientists in KLA’s metrology division, the...
Axion® T2000: X-Ray Vision for Vertical Memory Devices
Dec 6, 2022 3 min read
KLA’s new Axion® T2000 metrology system harnesses the power of X-rays to measure the complex vertical structures that form advanced memory chips....
New Orbotech Corus™ Offers Double-Sided Imaging for High-Density Interconnect PCBs and IC Substrates
Oct 24, 2022 3 min read
The new Orbotech Corus™ 8M direct imaging (DI) system is the first solution built on KLA’s all-in-one revolutionary Orbotech Corus...
Achieve ‘Zero Tolerance’ Die Sorting with ICOS™ F260
Sep 13, 2022 4 min read
Today’s chip manufacturers contend with strict requirements when it comes to quality assurance, since more complex chips are powering increasingly...