In the last few years, the role of semiconductor packaging has been evolving into a key enabler of the digital era.

Packaging manufacturing used to be only a means to protect and electrically connect chips but is now taking a more central role in helping increase the performance and capabilities of the device. With transistor scaling getting even more complicated and expensive, packaging has become an alternative way to offer faster performance, new functionality, reduced power usage and custom design shapes.

Packaging innovation has resulted in the expanded use of heterogeneous integration where different kinds of chips are combined into one package as well as the shrinking of feature dimensions and the utilization of a multitude of 2D and 3D integration schemes. These changes enhance performance and functionality, but generally result in increased complexity and new challenges for yield.

“Finding ways to overcome quality and yield challenges has always been a part of developing innovative technology. Imagine having to scrap an expensive multi-chip package because one of the integrated chips was defective. This will lead to additional screening inspections prior to the final package integration. At KLA, we have a history of supporting semiconductor technology inflections with process control, and combining this experience with our wide range of yield-enhancing process, inspection and metrology systems, makes us an ideal partner for packaging manufacturers looking to ramp new technologies.”

Oreste Donzella, executive vice president, electronics, packaging and components (EPC) group, KLA

KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers, foundries and IC substrate manufacturers for a wide range of packaging applications. Learn more about our packaging process control and process-enabling solutions for wafers, packaged components and IC substrates at kla.com/products/packaging-manufacturing.